3D00300 - SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames StdTpc-Chemical & Gas General Specifications 1 This Standard applies to

1 This Standard applies to the determination of metal extractable impurity characteristics of high purity materials and the wetted surfaces of components and equipment used in chemical distribution systems

This Guide defines the items/parameters to acquire silicon wafers to be used as carrier wafers in a temporary bond/debond (TBDB) application

This Guide addresses universal alignment mark

本方法で試験する融着接合部は，PFA融着継手でできている。

This specification is specific to Hydrogen (H2)

3D00300 - SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames StdTpc-Chemical & Gas General Specifications 1 This Standard applies toThis Guide provides the user with information about containers needed to ship thin wafers that are mounted on dicing tape to tape frames conforming to either SEMI G74 or SEMI G87. This Guide covers the shipping of 300 mm nominally diameter silicon wafers. The actual diameter of a 300 mm (nominal) silicon wafer may be less than 300 mm due to material removal via edge trim; the diameter of 300 mm silicon wafers fabricated specifically for use as carrier