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Detailed explanation of the principles of operation and construction of the instruments used is beyond the scope of this Guide
previously published August 2012
Underwriter’s Laboratory
Since there are more and more applications of electronic paper displays on the market nowadays
SEMI E90-0312 (technical revision)
G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded Detailed explanation of the principlesNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.